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BHEL Global Tender for 156.75 mm diamond wire saw multi silicon wafer

BHEL Electronics division, Bangalore has invited tenders from reputed companies for supply of silicon wafers. Details as follows.

Sl. No.

Material

Ref No

Due Date

Details can be downloaded at

1.

156.75 mm diamond wire saw multi silicon wafer

MDSSCPV035

  09.07.2018

http://www.bhel.com/tender/view_tender.php?tenderid=39358bullet

 

The tender details can be downloaded from www.bheledn.combullet  and  www.bhel.combullet.